Fully Automated Dicing System "7220 Series"
From development to mass production! Increased productivity through efficient wafer transport and rapid, precise alignment!
The "7220 Series" is a space-saving fully automated device that widely offers advanced automation and process monitoring mechanisms that meet the productivity and quality required for challenging dicing. Starting with efficient wafer transport systems for streamlined operations, it enhances productivity by shortening height measurement time through rapid and accurate alignment and a blade wear prediction algorithm. In addition to automatic blade sharpening with a dedicated dress cassette, it also excels in operability with a touch panel display. 【Features】 ■ Streamlined operations with efficient wafer transport systems ■ Rapid and accurate alignment with continuous digital image magnification devices ■ Reduced height measurement time with blade wear prediction algorithms ■ Excellent process results with spray-type wafer cleaning technology ■ Quality assessment during the process with built-in inspection trays *For more details, please refer to the PDF materials or feel free to contact us.
- Company：日本技術産業
- Price：Other
